Fluoropolymer (Perfluoroelastomer) Sealing Material (DUPRA)
What is DUPRA?
DUPRA is a perfluoroelastomer (FFKM) product with rubber elasticity provided by DAIKIN FINETECH of Daikin Group.
Similar to polytetrafluoroethylene (PTFE), Perfluoroelastomer features with diverse excellent performances such as thermal resistance, chemical resistance, non-adhesiveness, and weather resistance.
The polymer backbone of Perfluoroelastomer is composed of carbon and fluorine (C-F), which is higher and more stable binding energy than that of carbon and hydrogen (C-H) which are the backbone of common organic compounds, and thus Perfluoroelastomer demonstrates a high resistance performance to all external energies.
* An elastomer refers to a polymeric material capable of being deformed upon application of a weak force and quickly returning to its original size and shape upon release of the applied force, allowed by crosslinking the constituent high molecular polymers.
DUPRA Product Lineup
| Recommended Processes | Thermal Process Oxidation/Diffusion |
Plasma Process CVD/Etching/Ashing |
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|---|---|---|---|---|---|---|---|
| Product Lineup | DU353 | DU551 | DU553 | DU3R1 | DU341 | ||
| Features | Heat Resistant | Super Thermal Resistance | Super Thermal Resistance | Plasma Resistance | Fluorine Radical Resistance | ||
| Appearance |  |
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| Color | Black | Black | Black | Red | Brown | ||
| Thermal Resistant Temperature for Continuous Use (Reference) | [℃] | 295 | 300 | 300 | 295 | 295 | |
| Thermal Resistant Temperature (Reference) | [℃] | 310 | 330 | 330 | 305 | 305 | |
| Hardness(1)《ShoreA》 | － | 77 | 75 | 80 | 74 | 72 | |
| Tensile Strength(2) | [MPa] | 18.6 | 17.5 | 19.3 | 15.0 | 14.0 | |
| Elongation at Break(2) | [％] | 205 | 170 | 155 | 260 | 250 | |
| 100% Modulus(2) | [MPa] | 6.0 | 7.4 | 13.3 | 5.2 | 2.6 | |
| Permanent Compression Set(3) | After 70 Hours at 250°C | [％] | 8 | 8 | 9 | 12 | 10 |
| After 70 Hours at 300°C | [％] | 24 | 18 | 19 | 33 | 30 | |
| Option: Low Adherence Grade | 〇 | 〇 | 〇 | － | － | ||
Features of DUPRA by Article No.
| Article No. | Features |
|---|---|
| DU353 | A standard Model for thermal processing. Shows the excellent thermal resistance and gas resistance among FFKMs. |
| DU551 | A Model for super thermal resistance. Increased thermal resistance while maintaining the performance of DU353. Shows the top class heat proof performance among FFKMs. |
| DU553 | A Model for super thermal resistance. Increased thermal resistance while maintaining the performance of DU551. Dynamic sealing applications. |
| DU3R1 | A standard Model for plasma processing. Shows less weight fluctuation to oxygen and fluorine plasma, low dust generation. |
| DU341 | Having high fluorine type radical resistance, shows the highest performance in the plasma processing. |
Selection Chart of DUPRA by Application
| Process | Sealing Material Application Environment | Recommended Article No. | |||
|---|---|---|---|---|---|
| Temperature | Gas type | ||||
| Thermal Process |  |
LPCVD Oxidation Diffusion Lamp Anneal ALD |
25～ 300℃ |
O2, H2O, H2O2, O3,NH3, SiH4, N2, HCI,NF3, CIF3, F2, HF, etc |
DU551 DU553 DU353 |
| Plasma Process |  | HDPCVD PECVD MetalCVD Etching Ashing |
25～ 250℃ |
CF4, O2, HBr, Cl2,NH3, SiH4, H2O, Vaper, TEOS, NF3,CIF3, F2, HF, etc |
DU341 DU3R1 DU551 DU553 |
| Cleaning Process |  |
Cleaning Etching Stripping |
25～ 180℃ |
SC-1, SC-2, O3, HF,H2SO4, H2OVaper,IPA, H2O2, NH3,Hydroxilamine etc | DU551 |
Application Examples
- Components for Semiconductor Manufacturing Equipment
- Semiconductor Valve Seats